| 摘要 |
PURPOSE:To enable automation by previously determining a distance between a bonding prearranged point decided on a lead and a pad for a semiconductor chip as bonding length and making the end point of bonding length reach to the bonding prearranged point while using an electrode pad as a bonding starting point. CONSTITUTION:A semiconductor chip 2 is placed at a reference position on a support plate, and connected to a lead fitted on the support plate by using a bonding wire is predetermined length LL. When an electrode pad P1 for the chip 2 is displaced to P11, P2 to P12, P3 to P13 and P4 to P14 respectively at that respectively at that time, excess and deficiency are generated in the bonding wire in predetermined length LL. Accordingly, bonding loci toward reference bonding points L1-L4 are calculated by employing an automatic recognizing device making wire loop length constant and a sequence controller, and the chip 2 is compensated to the reference position by using another means. |
