| 摘要 |
PURPOSE:To prevent a photoconductive adhesion layer from creeping on the surface of light emitting elements by a method wherein creep preventing parts of conductive layer are provided either one of the light emitting element arraying parts of a printed substrate or both of an opposing surface of the light emitting elements to the printed surface. CONSTITUTION:Multiple grooves 24 are provided on the bottom of element arraying groove 23 of a printed substrate 21. Thus when LED arraying elements 25-27 are fixed, parts of pasty conductive adhesion layer 28 not contributing to adhesion of the elements 25-27 flows down into the grooves 24 consequently preventing the layer 28 from creeping on the surface electrodes 29 of elements 25-27. In this constitution, the grooves 24 are provided on the substrate 21 side only, however they may be provided on the elements 25-27 or on both the substrate 21 side and the elements 25-27 side. |
