| 摘要 |
PURPOSE:To equalize the length of runners from a cull at a central section by radially arranging a plurality of cavities for a resin mold previously when the cavities are formed to a package in which semiconductor elements are housed on a base for a transfer molding die. CONSTITUTION:A circular cull 17 collecting a molding resin is bored at the central section of a base 20 for a transfer molding die, a large number of runners 28 are lead out of the cull, and each end section of the runners is connected to resin inflow ports 15 for a large number of cavities 11 formed to the die. In the constitution, guides 13, gates 14 and runners 16 communicated with the gates 14 are fitted to chess-blocks 12 containing the cavities 11, but the runners 16 are all connected rectilinearly to the runners 28, and distances among the cull 17 and the chess-blocks 12 are all made uniform while preventing the generation of curved sections. Accordingly, no void is generated in the resin intruding into package in the cavities 11, and yield on molding is not deteriorated. |
