| 摘要 |
<p>PURPOSE:To enhance the bonding strength between a glass and a ceramic in a ceramic package which places and contain semiconductor elements such as an integrated circuit by forming an irregular surface of the size of 1-100mum on the boding surface of the ceramic. CONSTITUTION:A plurality of slender spinning grooves 8 are formed on the bonding surfaces of a ceramic substrate 7, and glass-sealed by the surface to enhance the bonding strength between the glass and the ceramic. An irregular surface of the size of 1-100mum is formed on the bonding surface of the ceramic to seal the glass. Accordingly, the surface area of the bonding portion of the ceramic substrate is increased due to the irregular surface in the amount of the increase in the area due to the irregular surface, the bonding strength between the glass and the ceramic is increased by the increse in the area, thereby enhancing the sealing effect. The surface is suitable in the range of 1-100mum, and if less than 1mum, the effective increase in the surface area is not obtained, while if more than 100mum, the increase in the effective area and hence the increase in the bonding strength of both is not obtained relative to the strength of the glass itself.</p> |
