发明名称 POLISHING DEVICE
摘要 PURPOSE:To selectively rotate and rectilinearly reciprocate a polishing tool to uniformly polish dies, by slidably engaging the gripping section of the polishing tool in an engaging mechanism which is coupled to the lower end part of a spindle, adjustably in the eccentricity of the mechanism, to adjust the eccentricity and to attach and removed a guide rod to and from the gripping section. CONSTITUTION:When a polishing tool 33 is rectilinearly moved, a spindle 35 is rotated by a motor after an engaging member 41 is made eccentric by a predetermined amount with respect to the spindle 35 by means of eccentricity adjusting screws 39, and therefore, the engaging member 41 is rectilinearly moved in the direction of eccentricity. Accordingly, a collect chuck 50 which is locked to the engaging member 41 is guided by means of a guide rod 46 to be subjected to elliptic motion nearly equal to a rectilinear motion, and therefore, a grind stone 55 gripped by the chuck 50 polishes a narrow surface in a die. Then, when a polishing tool 33 is desired to be rotated, the spindle 35 is positioned coaxially with the engaging member 41 by means of the adjusting screws 39 while the guide rod is released from the collect chuck 50 which is then held in an engaging mechanism 47, thereafter the grind stone 55 is rotated by rotating the spindle 35 so that the grind stone 55 polishes a wide area in the die.
申请公布号 JPS60186371(A) 申请公布日期 1985.09.21
申请号 JP19840041254 申请日期 1984.03.06
申请人 TOSHIBA KK 发明人 OOYAMA IWANE
分类号 B24B47/10;B24B47/12 主分类号 B24B47/10
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