发明名称 THERMOSETTING RESIN COMPOSITION AND PREPOLYMER THEREOF
摘要 PURPOSE:The titled solventless composition having a low viscosity, a long pot life and high heat resistance, containing a polymaleimide, an alkenylphenol (ether) and a polycarboxylic acid allyl ester. CONSTITUTION:A thermosetting resin composition containing a polymaleimide (e.g., N,N'-ethylenedimaleimide), an alkenylphenol and/or its ether (e.g., a reaction product between o-allylphenol and an aldehyde), and a polycarboxylic acid allyl ester (e.g., diallyl terephthalate). This is a thermosetting resin composition having heat resistance class C (>=180 deg.C), and particularly used as a solventless varnish for impregnation, casting, lamination, molding, bonding, etc.
申请公布号 JPS60184509(A) 申请公布日期 1985.09.20
申请号 JP19840038596 申请日期 1984.03.02
申请人 HITACHI SEISAKUSHO KK 发明人 KOYAMA TOORU;OOHAYASHI HIROKO;KATAGIRI JIYUNICHI;WAJIMA MOTOYO;MUKAI JIYUNJI
分类号 C08F20/00;C08F12/00;C08F20/52;C08F22/36;C08F22/40;C08F212/14;C08F222/40 主分类号 C08F20/00
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