发明名称 HIGH-STRENGTH COPPER ALLOY HAVING HIGH ELECTRIC CONDUCTIVITY
摘要 PURPOSE:To obtain a high-strength Cu alloy having high electric conductivity by adding specified amounts of Ni and Ti to Cu and restricting the P content to a specified value or below. CONSTITUTION:A Cu alloy having superior strength and electric conductivity is obtd. by adding 0.8-4.0wt% Ni and 0.2-4.0wt% Ti to Cu in 1-4 weight ratio of Ni/Ti and restricting the amount of P contained as an impurity to <=0.05wt%. To the alloy may be added <=2.0wt% in total of one or more among <=2wt% each of Al, Zn and Sn. The Cu alloy is used as the material of a lead frame for a semiconductor integrated circuit.
申请公布号 JPS60184655(A) 申请公布日期 1985.09.20
申请号 JP19840038616 申请日期 1984.03.02
申请人 HITACHI KINZOKU KK 发明人 WATANABE RIKIZOU;SAKAMOTO DAIJI
分类号 C22C9/00;C22C9/06;H01B1/02 主分类号 C22C9/00
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