发明名称 |
HIGH-STRENGTH COPPER ALLOY HAVING HIGH ELECTRIC CONDUCTIVITY |
摘要 |
PURPOSE:To obtain a high-strength Cu alloy having high electric conductivity by adding specified amounts of Ni and Ti to Cu and restricting the P content to a specified value or below. CONSTITUTION:A Cu alloy having superior strength and electric conductivity is obtd. by adding 0.8-4.0wt% Ni and 0.2-4.0wt% Ti to Cu in 1-4 weight ratio of Ni/Ti and restricting the amount of P contained as an impurity to <=0.05wt%. To the alloy may be added <=2.0wt% in total of one or more among <=2wt% each of Al, Zn and Sn. The Cu alloy is used as the material of a lead frame for a semiconductor integrated circuit.
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申请公布号 |
JPS60184655(A) |
申请公布日期 |
1985.09.20 |
申请号 |
JP19840038616 |
申请日期 |
1984.03.02 |
申请人 |
HITACHI KINZOKU KK |
发明人 |
WATANABE RIKIZOU;SAKAMOTO DAIJI |
分类号 |
C22C9/00;C22C9/06;H01B1/02 |
主分类号 |
C22C9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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