| 摘要 |
PURPOSE:To form a gently-sloping inclination at the edge part of a wiring layer by a method wherein the wiring layer formed by etching is coated by a resist film exposing only a part of the edge of the wiring layer, and the exposed part is isotropically etched. CONSTITUTION:After an aluminum layer is formed on the whole surface of an element 1, a wiring layer 2 is formed according to etching. Then, the whole surface of the element 1 is coated according to a resist film 6. The wiring layer 2 is etched by performing isotropic etching in such a condition. The isotropic etching thereof is performed to the grade to leave an inclined part at the edge of the wiring layer 2. Then, after the resist film 6 is disolved to be removed, an interlayer insulating layer 3 is deposited on the whole surface of the element 1. Accordingly, a comparatively gently-sloping inclination part is formed at the edge part, and when the interlayer insulating layer is deposited, a crack and an overhang are hardly generated, and reliability of the element is enhanced. |
