| 摘要 |
PURPOSE:To contrive to enhance the heat dissipating characteristic and mechanical strength of a resin sealed semiconductor device by a method wherein thickness of the prescribed regions of inner leads in a resin sealed body are made to be sifficiently thick similarly with a heat dissipating fin. CONSTITUTION:Inner leads 34 of the plural number of pieces are buried as to make the edge faces thereof to face to the side of a heat dissipating fin 30 in the neighborhood of the side parts of the heat dissipating fin 30 in a resin sealed body 32. Thicknesses of the regions 34a of the inner leads 34 corresponding to the L part of an interval from the side 32a of the resin sealed body 32 on the side led out with the heat dissipating fin 30 up to the edge face 30a of the heat dissipating fin 30 in the resin sealed body 32 opposite to the side 32a thereof is set to nearly the same thickness with the heat dissipating fin 30. As the thickness of the regions 34a thereof, it is desirable to be set to 0.8-1.0mm. or more, for example. Moreover, thickness of the regions 34b of the inner leads 34 in the resin sealed body 32 other than the regions 34a are set thin. |
