发明名称 SEAT PLATE FOR MOUNTING SOLID STATE ELECTRONIC DEVICE
摘要 <p>A thermally conductive electrically insulative laminate for use as chassis barriers in combination with solid-state electronic devices, the laminate comprising at least three layers and including a pair of outer layers disposed on opposite sides of a center layer. The center layer comprises a film of a polyimide (amide) filled with a quantity of either aluminum oxide or boron nitride particulate solids and included in an amount ranging from between about 10% to about 50% by volume. The outer layers consist essentially of silicone base rubber, and are preferably filled with a quantity of aluminum oxide or boron nitride particulate solids in an amount ranging from between about 25% and 50% by volume.</p>
申请公布号 JPS60183753(A) 申请公布日期 1985.09.19
申请号 JP19850001577 申请日期 1985.01.10
申请人 BAAGUKUISUTO CO:ZA 发明人 DEBITSUDO SHII DEGURII;HAABAATO JIEI FUITSUKU;BURUUSU ETSUCHI JIYUENGAA
分类号 H01L23/32;B32B27/34 主分类号 H01L23/32
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