| 摘要 |
PURPOSE:To check exfoliation of the oxide phase of a copper alloy lead frame by a method wherein copper plating of the specified thickness or more is performed to the whole surface of the lead frame manufactured of a copper alloy. CONSTITUTION:Copper plating of 1.0mum thickness or more is performed corresponding to plating hours to the whole surface of a copper alloy lead frame using bath composition of 60-120g/l of copper sulfate, 165-210g/l of sulfuric acid and 50-100ppm of chlorine ions at the temperature of 20-30 deg.C at current density of 1-4A/cm<2>, and using copper containing phosphorus as an anode, for example. Accordingly, the oxide phase is not formed more than 1.0mum thickness during a heating process, and moreover because a copper plated layer 62 and the oxide phase 61 have favorable adhesion to generate no exfoliation, trouble of a device to be caused according to the oxide phase 61 and reduction of reliability, and the erroneous operation of the circuit of a semiconductor device are not generated, and a favorable assembling process can be attained. |
