| 摘要 |
PURPOSE:To fix residual metal corpuscles when a package sealing cover for an SAW device, etc. is to be manufactured by a method wherein a thin film according to resin paints or a hardening type adhesive, etc. is formed on the inside wall surface of the sealing cover, or the resin film is provided between the inside wall surface of the sealing cover and the SAW device, etc. CONSTITUTION:An SAW device 2 is fixed on a base 1, and after a lead 4 to penetrate airtightly the base 1, and the IDT electrode of the SAW device 2 are connected according to a bonding wire 5, a sealing cover 7 performed with resin coating 6 on the inside wall surface is welded thereto to seal up tightly the SAW device 2 in a package. At this case, it is desirable to stop the resin coated part 6 in the neighborhood of the contact part between the inside wall of the sealing cover 7 and the outer peripheral side wall of the base 1. As the coating material to be used, emulsion paints, rapidly drying paints using an organic solvent such as toluene, xylene, etc. on the market, and moreover baked type paints thereof or two-pack type polymerization hardening resin such as epoxy adhesive or silicon adhesive, etc. can be selected properly to be used. |
