PRESSURE CLAMP FOR MOUNTING SEMICONDUCTOR PACKAGES

摘要

A semiconductor capsule clamp comprises a generally bowed spring 1 and a spring loading member 6. A capsule (not shown) is positioned under a centre section of the spring against, for example, a heat sink (not shown) and as the loading member 6 is bolted down onto the heat sink it abuts the ends of the spring 1 thereby exerting a compression on the capsule through cantilever action. An indicator wire element 34 is included in the assembly. In the unstressed condition this element is located loosely in the assembly adjacent to the spring but has a part 35 which is arranged to be trapped when a pre-arranged loading is applied to the spring. A correct loading may therefore be sensed by testing the indicator wire element for looseness.