发明名称 |
CIRCUITO INTEGRATO PROTETTO,RELATIVO SUBSTRATO DI INTERCONNESSIONE PROTETTO E RELATIVO PROCEDIMENTO DI PRODUZIONE |
摘要 |
A chip 6 forming an integrated electrical circuit has a working face 6a provided with circuit components connected to terminals situated at the periphery of the working face 6a which is entirely covered with a surface layer 9 of insulating resin e.g. silicone resin, which is resilient or in the form of a solidified gel and which does not extend beyond the boundaries 10 of the working face 6a, and the tangent to the resin surface at the periphery makes an angle of from 25 DEG -45 DEG with the working face 6a. <IMAGE> |
申请公布号 |
IT1098983(B) |
申请公布日期 |
1985.09.18 |
申请号 |
IT19780028365 |
申请日期 |
1978.10.03 |
申请人 |
CIE INTERNATIONALE POUR L'INFORMATIQUE CII-HONEYWELL BUL |
发明人 |
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分类号 |
H01L23/28;H01L21/56;H01L23/29;H01L23/31;H01L25/04;H01L25/18;(IPC1-7):H05K/ |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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