| 摘要 |
PURPOSE:To remove the adhesion of a foreign matter due to the interposition of a human being, and to improve the throughput of the whole system by continuously executing the application of a resist, exposure and development during a time when a wafer is moved to an unloading section from a loading section. CONSTITUTION:A loading cassette 32, a resist applying and baking device 1 and a wafer carrying path changeover section 33 are connected in series, and an exposure device 9 is installed on the downstream side of these devices and members. A wafer exposed in the device 9 is forwarded to another wafer carrying path changeover section 34 again, and returned to an unloading cassette 44 through a developing and baking device 14. In the constitution, buffer cassettes 35 and 36, belt carrying mechanisms 37 and 38 and 41, sensors 42 and 43, etc. are each mounted previously to several changeover section 33 and 34, and the attitude of the wafer is corrected in the changeover sections 33 and 34 while the wafer is not passed through the device 9 and is fed directly into the device 14 when it is exposed previously. Accordingly, the title processor is proper to the manufacture of an ultra LSI, etc. |
