| 发明名称 |
TELESCOPING THERMAL CONDUCTION ELEMENT FOR SEMICONDUCTOR DEVICES |
| 摘要 |
<p>A telescoping heat exchange element for conducting heat in a semiconductor package from a device to a spaced heat sink having a first cup-shaped member, a second cup-shaped member positioned in telescoping slidable relation with the first member, and a means to provide a firm sliding contact between the first and second members.</p> |
| 申请公布号 |
EP0088246(A3) |
申请公布日期 |
1985.09.18 |
| 申请号 |
EP19830101181 |
申请日期 |
1983.02.08 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BALDERES, DEMETRIOS;HORVATH, JOSEPH LOUIS;LIPSCHUTZ, LEWIS DRUCKER |
| 分类号 |
H01L23/44;F28F3/02;H01L23/36;H01L23/433;(IPC1-7):H01L23/42 |
主分类号 |
H01L23/44 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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