| 摘要 |
PURPOSE:To contrive improvement in degree of integration as well as to simplify a cutting device by a method wherein, after a write-in operation of a read- only memory circuit has been finished, a wiring part is cut off using an energy beam. CONSTITUTION:Pads P0-Pn are provided on the scribe line SL located on a semiconductor wafer, and they are connected to one end of fuses F0-Fn by wirings L0-Ln which are constituted by aluminum conductive layers. When an unsatisfactory circuit part is detected in a performance test of an integrated circuit device performed on a wafer stage, the related fuse is burnt out in accordance with the address information of said unsatisfactory circuit part. After the address of the unsatisfactory circuit part has been written in a read-only memory storage, the wafer is cut off along the scribe line SL, and it is divided into integrated circuit chips. After the wafer has been cut off, the wiring L0-Ln are cut off using the energy beam such as a laser beam and the like. |
