发明名称 MEASUREMENT OF PLATING THICKNESS
摘要 PURPOSE:To enable a highly accurate measurement of plating thickness while facilitating the flattening work by flattening convexes and concaves of a planar part by a fixed rolling force. CONSTITUTION:Convexes or concaves are provided at the end section of a planar part 5 and a plating layer 7 is formed on the surface thereof. A rolling die 10 is made up of a die plate 11 having an insertion groove 12, a press plate 14 having a press tappet 15, a holder plate 16 for pressing the plate 14 through a compression coil spring 18 and the like. Then, to flatten the convexes and concaves of the part 5, the part 5 is inserted into the insertion groove 12. Then, a press is operated manually to lower the plate 16 so as to make the undersurface of the tappet 15 abut against the top surface of the part 5 to press the part 5 by an elastic pressure proportional to the compression of the spring 18 to be flat. Thus, after the part 5 is flattened with the rolling die 10, an X ray plating thickness measuring apparatus is set on the surface of a plated layer 7 to measure the plating thickness.
申请公布号 JPS60181609(A) 申请公布日期 1985.09.17
申请号 JP19840037860 申请日期 1984.02.29
申请人 FUJITSU KK 发明人 HOSHINO TADASHI
分类号 C23C2/14;G01B15/02;G01B21/08 主分类号 C23C2/14
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