| 发明名称 |
TAPE FOR MOUNTING CONDUCTIVE DIE AND ITS APPLICATION |
| 摘要 |
A conductive die attach type is described which allows for mounting of diced semiconductor chips thereon, followed by removal of the chip with an adherent conductive adhesive, and the mounting of the chip/adhesive combination in a chip carrier preparatory to the wire bonding operation. |
| 申请公布号 |
JPS60182200(A) |
申请公布日期 |
1985.09.17 |
| 申请号 |
JP19850013678 |
申请日期 |
1985.01.29 |
| 申请人 |
STAUFFER CHEM CO |
发明人 |
JIYOSEFU ANTONII OORICHIO |
| 分类号 |
B65D73/02;H01L21/68;H01L23/482;H05K3/32 |
主分类号 |
B65D73/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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