发明名称 MEASUREMENT OF FILM THICKNESS
摘要 PURPOSE:To enable the measurement of the film thickness over the entire deposited surface in the measurement of the film thickness of a film deposited on a substrate by gauging the evaporation speed over the entire area of the deposited surface with a film thickness measuring sensor movable freely by a driver. CONSTITUTION:A crucible 2 is heated with a vacuum vessel 1 vacuum inside and a metal steam is jetted out to form a deposited film on a substrate 4. A shutter 6 prevents metal from evaporation on the substrate 4 during the measurement with a film thickness measuring sensor 3. The sensor 3 mounted on a support rod 7a is so arranged to be movable freely with a driving mechanism 7. Then, first, with the shutter 6 positioned in front of the deposited surface of the substrate 4, the sensor 3 is set at any position of the deposited surface with the driving mechanism 7 through the support rod 7a to measure the evaporation speed over the entire deposited surface. Subsequently, the shutter 6 is moved and metal is deposited on the substrate 4. Then, the deposited film thickness is measured over the entire deposited surface.
申请公布号 JPS60181610(A) 申请公布日期 1985.09.17
申请号 JP19840038305 申请日期 1984.02.28
申请人 MITSUBISHI DENKI KK 发明人 IWATANI YASUYUKI;MORI EISAKU;MINOWA YOSHIFUMI
分类号 C23C14/54;G01B21/08 主分类号 C23C14/54
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