| 摘要 |
In an arrangement for evaporatively cooling a wafer-type high-loaded semiconductor component (10, 11, 12) which is clamped between two heat dissipaters (91 to 95) by means of tie bolts (15, 16, 17), the object is that the heat transfer to the cooling liquid takes place as near as possible to the semiconductor components (10, 11, 12), with a sufficiently large surface. At the same time, the object is to guarantee that, in the case of a stack of semiconductor components which are each clamped between two heat dissipaters, a compact clamping facility is available which is easy to assemble and stable along the longitudinal axis. For this purpose, according to the invention, the arrangement, which is completely surrounded by an evaporative cooling liquid, has two heat dissipaters (91 to 95) which each support a wafer-type semiconductor component (10, 11, 12) between them and are provided, on the side (3) remote from the region of contact (2) with the semiconductor component (10, 11, 12), with studs (4) which are arranged at an angular pitch of 120 DEG . The clamping force of three tie bolts (15, 16, 17), which are symmetrically arranged with respect to one another, is transmitted to the semiconductor component (10, 11, 12) via the studs (4). The heat dissipaters (91 to 95) are constructed in the form of an equilateral triangle having a guide hole (1) for one of the tie bolts (15, 16, 17) in each of its corner regions. <IMAGE> |
