| 摘要 |
PURPOSE:The titled coating compound useful for electronic parts, forming a film having improved antistatic properties, chemical resistance, etc., obtained by blending a hydroxyl group-containing copolymer comprising a hydroxyl group- vinyl monomer, vinyl chloride monomer, etc. with electrically-conductive fine powder comprising tin oxide, having an electrically-conductive layer, in a specific ratio. CONSTITUTION:(A) 100pts.wt. hydroxyl group-containing copolymer comprising (i) 2-20mol% hydroxyl group-containing vinyl monomer [e.g., hydroxyethyl (meth)acrylate, etc., (ii) 80-98mol% vinyl chloride monomer, and (iii) 0-18mol% another polymerizable monomer (e.g., styrene, etc.) is blended with (B) 70- 350pts.wt. electrically-conductive fine powder having an electrically-conductive layer comprising tin oxide as a main component preferably blended with antimony on the surface, to give the desired coating compound. USE:For covering containers for semiconductor wafer, clean benches, floor covering materials and wall materials for semiconductor preparation plant, electrical members, etc.
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