| 摘要 |
PURPOSE:To obtain a Cu alloy for the material of the titled lead having superior electric conductivity, high heat resistance and elongation by adding specified percentages of Cr, Ni, Sn and Ti to Cu. CONSTITUTION:A Cu alloy consisting of, by weight, 0.05-0.50% Cr, 0.20-1.2% Ni, 0.30-1.5% Sn, 0.10-<1.0% Ti and the balance Cu with inevitable impurities or further contg. 0.01-<0.1% Si and/or 0.01-0.12% Zr is manufactured. The Cu alloy has superior performance as the material of a lead for a semiconductor apparatus.
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