发明名称 METHOD AND DEVICE FOR FORMING FILM
摘要 PURPOSE:To form films having a desired thickness distribution by vapor deposition on a substrate in the stage of forming the films deposited by evaporation of various materials on the substrate surface in a vacuum vessel by interposing a mask plate having apertures of a prescribed shape between the substrate and vapor deposition sources and moving periodically said mask relatively with the substrate. CONSTITUTION:A substrate 5 manufactured of plastic, metal, glass, new ceramics, etc. is attached to a support 6 connected to a driving device 8 in a vacuum vessel. A heater 4 contg. a raw material 3 for vapor deposition such as a metal, metallic compd., alloy is placed below the substrate 5. A stainless steel mask plate 7 having apertures 7a of various shapes is placed between the substrate 5 and the source 3. The inside of the vessel 1 is evacuated to a vacuum by an evacuating system 2 and the material 3 is heated to evaporate, thus forming a tightly adhered film on the substrate 5. The relative positions of the mask plate 7 and the substrate 5 are periodically fluctuated by which the film deposited by evaporation having a desired thickness distribution is formed on the surface of the substrate 5 in the relative relation with the shape of the apertures 7a.
申请公布号 JPS60181264(A) 申请公布日期 1985.09.14
申请号 JP19840034046 申请日期 1984.02.24
申请人 KONISHIROKU SHASHIN KOGYO KK 发明人 ITOU KOUICHI
分类号 C23C14/24;C23C14/04 主分类号 C23C14/24
代理机构 代理人
主权项
地址