| 摘要 |
PURPOSE:To facilitate welding connection of lead wires because of a low melting point of an electrode film by forming a Ti or Zr film on the surface of a supporting vessel and adhering a ceramic insulating substrate and the supporting vessel to each other by soldering to make it possible to use the thick electrode film. CONSTITUTION:A Ti or Zr film 10 is formed on the surface of a supporting vessel 8 to adhere a ceramic insulating substrate 4 and the supporting vessel 8 to each other by soldering. Since no metallized films are used at all, a thick electrode film 5 can be used. Since the melting point of this electrode film 5 is lower than that of a metallized electrode film, welding connection of lead wires is easy, and the reliability of welding is high. The thick electrode film is formed by sintering in air at 600-1,000 deg.C. Thus, the electrode film is formed easily without special equipments to reduce the production cost. |
