| 摘要 |
PURPOSE:To partially suppress corrosion of bonding pad and improve moisture proof characteristic by pressurizingly integrating a bonding ball of bonding wire and a protruded part which is internally protruded to the bonding pad from internal circumference of aperture of surface protection layer. CONSTITUTION:The circumferencial edge of bonding pad 6 consisting of wiring layer 3 being exposed to an aperture 5 is covered with a surface protection layer 4. As this surface protection layer 4, for example, a silicate glass obtained by a low temperature vapor growth method. The protruded portion 4a internally protruded to the bonding pad 6 from the internal circumferencial edge of aperture 5 of surface protection layer 4 is pressurizingly integrated with the bonding ball 7a of bonding wire 7 to be bonded to the bonding pad 6. Thereby, the region corresponding to the protruded part of bonding pad does not corrode even when the bonding pad starts to corrode due to the entrance of water and disconnection by corrosion can be prevented, improving moisture proof characteristic. |
