| 摘要 |
PURPOSE:To improve workability on assembly, stability for a prolonged period of time and temperature characteristics by fixing a metal coating optical fiber piece to a ceramic vessel by using a low melting-point glass material, joining a thin cover for sealing with the ceramic vessel and hermetically sealing an optical semiconductor element. CONSTITUTION:The titled package is constituted by a heat-dissipating substrate (such as an Si substrate) 32 on which a laser diode chip 31 is placed, optical terminals 33 and 34, which consist of metal coating optical fiber pieces and are arranged opposed to the laser diode chip 31, a ceramic vessel 35, which houses the substrate 32 and the chip 31 and from which the optical terminals 33 and 34 are projected, electric terminals 36 for connection to the outside, a picture- frame-shaped seal ring 38 made of Kovar or ceramics disposed to the ceramic vessel 35 through a low melting-point glass layer 37, and a cap 39 for sealing made of Kovar or ceramics covering the seal ring 38. Two optical terminals 33 and 34 are used as an optical signal output terminal from the laser chip 31 and a monitor terminal for an optical output respectively. |
