| 摘要 |
PURPOSE:To increase the amount of vertically incoming beams and the adhesion of dice bonding by bending a lead end section formed by a metallic piece, on which a semiconductor light-emitting element is loaded, after a predetermined back region is thinned through etching, etc. and using the lead end section as an optical reflection wall. CONSTITUTION:The thickness of lead boards in the peripheries of light-emitting element loading regions in element loading leads for a lead frame 10 is formed thinly, and the thin sections are bent at fixed angles so that light emission from the light-emitting element is reflected to a light-receiving surface for a light- receiving element at a right angle. The regions such as prescribed back regions 15a at both ends sections of the lead frame are thinned through etching to thickness of approximately half the thickness of a frame board, and the thin frame pieces are used as metallic reflection walls 15. The lead frame pieces having such shapes are machined by a press by a mold having shapes corresponding to bending. Accordingly, the central section of the lead can hold flatness, and the amount of light vertically incoming into the light-receiving surface for the semiconductor light-receiving element can be increased while the adhesive strength of dice bonding can be augmented. |
