发明名称 MANUFACTURE OF CHIP FOR SHIELDING ELECTROMAGNETIC WAVE COMPOSITION
摘要 PURPOSE:To produce effectively the chip in which the length of metallic fiber is kept at a specified length by a method in which the metallic long fiber having been bundled into a tow shape is dipped into the bath of thermoplastic resin monomer and the thermoplastic resin stuck thereon is polymerized, and then the metallic long fiber coated with the thermoplastic resin polymer having been formed, is cut into suitable length. CONSTITUTION:The metallic long fibers made by drawing process, i.e. each fiber of aluminium, copper and brass, may be used for the metallic long fibers bundled into a tow shape, and the diameter of the fiber is about 1-100mum. The metallic long fibers bundled in such a tow shape are dipped in the bath of thermoplastic resin monomer. 5wt% thermoplastic resin monomer is preferably stuck to the metallic fiber. Next, the thermoplastic resin monomer stuck onto the metallic fiber is polymerized, and the layer of the thermoplastic resin polymer is formed on the surface of the metallic fiber. The obtained metallic fiber is cut into a suitable length, and thus, the chip for shielding electromagnetic wave composition may be obtained.
申请公布号 JPS60179204(A) 申请公布日期 1985.09.13
申请号 JP19840036929 申请日期 1984.02.28
申请人 FUJIKURA GOMU KOGYO KK 发明人 AKAKABE MICHIO;TAKAHASHI HITOSHI
分类号 H05K9/00;B29B9/06;B29B9/14;B29K105/22;H01B1/22 主分类号 H05K9/00
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