| 摘要 |
PURPOSE:To obtain a substrate with bumps, height thereof hardly disperses and cost thereof is low, by making a non-conductive material besides a conductive material to be contained in the bumps. CONSTITUTION:Paste for forming bumps in which non-conductive vitreous powder is mixed into conductive metallic powder is prepared, and paste is printed on one surface of a substrate by using a plate making member having fixed thickness, thus manufacturing the bumps 10. When the bumps 10 are shaped to a chip carrier 11, through-holes are formed on a ceramic green sheet, the green sheet is metallized by using tungsten or molybdenum, and a predetermined wiring pattern and a through-hole metallizing layer are shaped through a printing method. A metallic mask having thickness such as approximately 200mum one or a mesh type mask is employed as a plate material for bump printing, and said paste for forming the bumps is printed and baked, thus obtaining the ceramic sheet 11 with the wiring pattern and the bumps 10. |
