| 摘要 |
The invention relates to a cooling socket, consisting of heat-conductive material, for an electrical component, for example for disc thyristors or high-power resistors. The cooling socket consists of two partial pieces (1a, 1b), at least one of which has a heat-transfer surface (2, 3) which is used for heat-conducting connection to the component. In the region of the heat transfer surface (2, 3), at least one flow channel (11) for a cooling medium is provided, which runs from an inlet opening to an outlet opening. In order to be able to connect the two partial pieces (1a, 1b) of the cooling socket to one another in a liquid-proof manner and in a simple manner, the flow channel (11) is formed by a groove (4a, 4b) in one of the partial pieces (1a, 1b), the other partial piece (1a, 1b) having ribs (5a, 5b) which engage in an approximately positively-locking manner in the grooves (4a, 4b) of the other partial piece (1a, 1b). The height (h) of the ribs (5a, 5b) is less than the depth (t) of the grooves (4a, 4b), as a result of which the cross-section of the flow channel (11) is defined. <IMAGE> |
