| 摘要 |
PURPOSE:To obtain a film circuit type amplifier for superhigh frequency band having satisfactory high frequency characteristics with small loss, by adhering a conductor bar having the thickness with which the same height is obtained as the height of a terminal for superhigh frequency signal piercing through a package onto a film circuit substrate and connecting an external lead-out terminal and said circuit substrate via said conductor bar by a wiring process using a gold wire press-fixed by heat, etc. CONSTITUTION:A trapezoidal conductor bar 7 is adhered upside down to a wiring on a film circuit substrate 1 by a soldering process, etc. The wiring is secured between the bar 7 and an external lead-out terminal 5 with heat press- fixture of a gold wire 6, etc. This method reduces the inductance of the bar 7 between the terminal 5 and the substrate 1 owing to the reduced ascending inductance for wiring of the line 6, etc. in comparison with a conventional case where the direct wiring is secured between the terminal 5 and the substrate 1 by press-fixing a gold wire with heat. Furthermore the variance of wiring length is reduced owing to a short distance between the terminal 5 and the bar 7. |
