| 摘要 |
PURPOSE:To obtain easily the titled compound useful as a raw material for silicon carbide filaments, by heating a polydimethylsilane at a specific temperature in an inert gas atmosphere, heat-treating a low-molecular weight organosilicon compound formed by the thermal decomposition at a specific temperature, and separating the aimed compound by distillation. CONSTITUTION:A polydimethylsilane having repeating units of the formula is heated at 300-500 deg.C in an inert gas atmosphere, e.g. Ar, and a low-molecular weight organosilicon compound formed by the thermal decomposition is distilled to the outside of the system. 1-5wt% polyboronylsiloxane, etc. is preferably added to the above-mentioned distillate, and the resultant mixture is heat-treated at 150-300 deg.C in an inert gas atmosphere, e.g. Ar, to separate the aimed compound by distillation.
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