| 摘要 |
PURPOSE:To conduct soldering with high reliability, by a method wherein a semiconductor is mounted and adhered, Sn-Sb solder which is vacuum melted being dropped with detrermined quantity on a metal piece which is possible to be soldered. CONSTITUTION:The metal piece 1 is heated on a device 5 and a vamp 8 is made by dropping determined quantity of vacuum melted Sn-Sb solder from a device 6. A semiconductor is mounted and adhered and secured on the solder 8 by pressing and swinging 9 it. Through this constitution, the wetting characteristics for the metal piece is excellent, since solder is vacuum melted and generation of air bubbles are few, besides the surface oxidation of soler is remarkably reduced because of pressing and swinging the semiconductor just after droping solder, and the soldering with high reliability can be applied. |
