| 摘要 |
It is possible to prepare fragile devices by the removal of part of a suitable body of material (by an etching or similar removal process), and this technique is particularly applicable to the formation of lead-frames useful in connection with the packaging of micro-electronic devices such as integrated circuits (chips); starting with a foil or sheet blank of relatively thick, robust material, this material is removed, usually by etching, where it is not required at all (the empty spaces between the leads). Unfortunately, it is very difficult to start with a thich and robust foil and end with a lead-frame the inner parts of which are sufficiently narrow and delicate for use with a device having a lead count as high as 50 connections per side, when the width of the individual leads at their "fine" end must be as little as 0.05mm (50 microns). The invention suggests a technique whereby most of the thickness of the material over the whole of the lead-frame foil blank's inner area (where the inner connections to the chip will eventually be) is removed from one face to make a generally robust foil with a centrally-located recess defining a much thinner inner section, the recess is filled with some "fixing" material that will both provide support for and hold in position the thin inner section, and further material is then removed from the other face of the blank so as to form the fine inner parts (25) of the lead-frame, these being firmly supported, and held in place, by the "fixing" material (23) filling what was the recess in the foil. |
