| 摘要 |
PURPOSE:To enable to join a semiconductor chip and a metal conductor in a short time by a method wherein a carbon electrode having a large resistance is made to come in contact to one side of the metal conductor being subjected to a soldering treatment, where it is to be heated, while an ordinary electrode is made to come in contact with the other part of the one side, and the metal conductor is energized. CONSTITUTION:A solder is precoated on the junction interface of a metal conductor 2 and a semiconductor chip 1, the chip 1 is put on the conductor 2, a carbon electrode 6 is made to come in contact to the back surface of the conductor 2 and an ordinary electrode 6' is made to come in contact to the other part of the back surface, voltage is applied to the elecrodes 6 and 6' from a power source 4 through a sliduck 8 and the conductor 2 is conducted. When voltage is slightly applied to the chip 1 and the chip 1 is conducted, the carbon electrode 6 generates heat, the solder having been precoated on the junction interface of the conductor 2 and the chip 1 is melted, and the conductor 2 and the chip 1 are junctioned. According to this method, a soldering can be carried out in a very short time without conducting to the chip 1 while the current value of current to be conducted to the conductor 2 is adjusted and no bad influence affects the chip 1. When chips are soldered on both faces of the metal conductor, a carbon electrode is provided in the vicinity of a part on one side of the metal conductor, where it is subject to soldering. When chips are soldered on both faces of the metal conductor in a sandwich type, one side only of the metal conductor is conducted and heated, the heat is transmitted to the other side through the chip on the one side. By this way, it is also possible for chips to be joined on both faces of a metal conductor. |
