发明名称 Semiconductor planarization process and structures made thereby.
摘要 <p>A silicon substrate having a silicon dioxide bird's head is provided. A thermal oxide layer is grown on the exposed silicon surface. A layer, e.g., 4000 A DEG , of phosphogermanosilicate glass is deposited on the thermal oxide and on the silicon dioxide bird's head. The structure is heated to 950 DEG C, causing a reflow of the glass which results in a planar surface. The thermal oxide and the phosphogermanosilicate glass are then wet etched at the same rate with a solution of hydrofluoric acid, ammonium fluoride, and deionized water. The wet etch is terminated when the exposed silicon surface is reached, resulting in a smooth surface as defined by the planar reflow surface. Other embodiments are disclosed.</p>
申请公布号 EP0154573(A2) 申请公布日期 1985.09.11
申请号 EP19850400163 申请日期 1985.02.01
申请人 FAIRCHILD CAMERA & INSTRUMENT CORPORATION 发明人 BURTON, GREG
分类号 H01L21/306;H01L21/302;H01L21/3065;H01L21/3105;H01L21/311;H01L21/316;H01L21/762 主分类号 H01L21/306
代理机构 代理人
主权项
地址