发明名称 RESIST PROCESSING DEVICE
摘要 PURPOSE:To form a resist pattern with high precision efficiently and rapidly by controlling the sensitivity to electromagnetic wave of resist or corpuscular irradiation without deteriorating the resolving power by a method wherein a resist film is baked and cooled at the same place by means of spraying process to cool its surface evenly. CONSTITUTION:A substrate to be processed 42 is coated with a resist film in the place other than a table 41 by means of e.g. a spin coating process. Firstly the resist film baked by a heater 43 at the specific temperature exceeding the glass transition point of resist for specific time. Secondly cooling regrigerant is sprayed while turning the substrate 42 with resist film to be processed using multiple nozzles 45 to cool the overall resist film evenly. At this time, the nozzles 45 spray the refrigerant with temperature and flow rate preliminarily and independently programmed. After the cooling process, the substrate 42 with resist film may be selectively irradiated by electromagnetic wave with specific wave length or corpuscular ray with energy specific to expose the resist film.
申请公布号 JPS60176236(A) 申请公布日期 1985.09.10
申请号 JP19840032066 申请日期 1984.02.22
申请人 TOSHIBA KK 发明人 KIRITA KEI;SHINOZAKI TOSHIAKI;KATOU YOSHIHIDE;SUZUKI TAKASHI
分类号 G03F7/26;G03F7/16;G03F7/20;H01L21/027 主分类号 G03F7/26
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