| 摘要 |
PURPOSE:To obtain a semiconductor device constituted through a piggyback method, through which thermal abnormality on mounting is not generated, by fitting a plate piece consisting of a material having high thermal conductivity between vertically superposed semiconductor device bodies. CONSTITUTION:A semiconductor device 1 is connected to a semiconductor device 1' in a section lower than the device 1 on solder or spot welding by a plurality of severally opposite leads lead out of a side surface. A plate piece 3 consisting of a material having high thermal conductivity in copper, etc. is bonded between the semiconductor devices 1, 1' so as not to be brought into contact with the leads 2. Accordingly, heat generated by power consumed on the operation of the semiconductor devices is dissipated to an atmosphere on the outside of the devices through the high thermal-conductivity material plate piece 3, thus relaxing the temperature rise of the semiconductor devices. |
