发明名称 |
MAGNETRON SPUTTERING APPARATUS |
摘要 |
<p>SPUTTERING APPARATUS AND METHOD A apparatus and method is described for the magnetron sputtering of a workpiece to deposit a thin metallic film. A rotating magnetic field is provided in the vicinity of the workpiece to produce higher yield from a given cathode target.</p> |
申请公布号 |
CA1193227(A) |
申请公布日期 |
1985.09.10 |
申请号 |
CA19820415872 |
申请日期 |
1982.11.18 |
申请人 |
CANADIAN PATENTS AND DEVELOPMENT LIMITED-SOCIETE CANADIENNE D |
发明人 |
RAMACHANDRAN, KOVILVILA;GIANI, ENRICO |
分类号 |
C23C14/34;H01J37/34;(IPC1-7):C23C14/00 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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