发明名称 MAGNETRON SPUTTERING APPARATUS
摘要 <p>SPUTTERING APPARATUS AND METHOD A apparatus and method is described for the magnetron sputtering of a workpiece to deposit a thin metallic film. A rotating magnetic field is provided in the vicinity of the workpiece to produce higher yield from a given cathode target.</p>
申请公布号 CA1193227(A) 申请公布日期 1985.09.10
申请号 CA19820415872 申请日期 1982.11.18
申请人 CANADIAN PATENTS AND DEVELOPMENT LIMITED-SOCIETE CANADIENNE D 发明人 RAMACHANDRAN, KOVILVILA;GIANI, ENRICO
分类号 C23C14/34;H01J37/34;(IPC1-7):C23C14/00 主分类号 C23C14/34
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