| 摘要 |
PURPOSE:To improve stamping capability by making a specific quantity of Pb contain in a Cu alloy including Fe and P. CONSTITUTION:0.001-0.010wt% Pb is included in a lead material for a semiconductor having a composition consisting of 0.05-0.25wt% Fe, 0.015-0.070wt% P, Cu and unavoidable impurity residue. Accordingly, no heat dissipating properties, plating properties, conductivity, heat-resistant softening properties and repeated flexing-resisting properties is damaged, and stamping capability can be improved. When the content of Pb exceeds 0.001%, plating properties and repeated flexing- resisting properties are deteriorated because the quantity of Pb precipitating on grain boundaries in an alloy composition and in grains is increased. |
