发明名称 (A) ;LOOSE TAKING-UP OF BAND-SHAPED MATERIAL
摘要 PURPOSE:To mold hollow moldings in thermal plastic resin, which inside is provided with an insert, by pre-blowing thermal plastic resin melted parison, by bonding insert parts on an inwall surface of parison and by blowing in air. CONSTITUTION:A metal mold 4 is closed while insert parts 3 held by means of a lever body 2 remain as they are located at the inside of thermal plastic melted parison 1 extruded or injected from a die, and the parison is pre-blown. Just after pre-blowing parison, the insert parts 3 grasped by means of the lever body 2 are moved in the lateral direction by means of a functioning mechanism mounted into the lever body 2 and bonded to an inwall surface of the parison, and air is blown in.
申请公布号 JPS6040367(B2) 申请公布日期 1985.09.10
申请号 JP19780079793 申请日期 1978.07.03
申请人 SHOWA DENKO KK 发明人 SASAKI TAKESHI;HATAKEYAMA TETSUYA;YAMADA TAKEMITSU
分类号 B29B11/08;B29B11/10;B29C49/00;B29C49/04;B29C49/06;B29C49/18;B29C49/20;B29C49/58;B29C65/00;B29L22/00 主分类号 B29B11/08
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