Self-positioning heat spreader

摘要

A heat spreader which is self-positioning into a mold cavity prior to encapsulation in plastic is provided. To minimize capacitance between the spreader and a metal lead frame having a semiconductor die mounted thereon, the heat spreader has a frame with notches in the opposite ends which define bifurcated limbs. Lateral standoffs extend from each of the sides thereof and feet extend from the bottom surface thereof. A central portion extends a predetermined distance from the top surface thereof for intimate positioning with the lead frame. The standoffs, limbs and feet are sized to firmly position the heat spreader upon insertion into the mold cavity. To maintain substantially constant capacitance between the spreader and the lead frame from part to part, each bifurcated limb has an inner edge which complements or conforms to the portion of the lead frame which will overlay the limb in the encapsulated plastic.