发明名称 MANUFACTURE OF LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the deformation of the nose sections of inner leads during a plating process, and to improve yield on manufacture by executing the plating process under the state in which the noses of a plurality of the lead sections are connected mutually by a support band. CONSTITUTION:A conductive metallic sheet is etching-machined or press-machined, and a bed section 21 connected and supported to an outer frame through hanging pins 22 and a support band 24 mutually connecting the nose sections of a plurality of lead sections 23 are formed. The support band 24 is connected and supported to the bed section 21 through connecting bands 25. Necessary sections are plated with silver, etc. through a plating process. Deformation is prevented approximately completely because the noses of the inner lead sections 23 are supported by the supporter 24. The plating process is completed, a region shown by a dot-dash line is punched by a press, and the noses of each inner lead section 23 is separated severally independently.
申请公布号 JPS60176260(A) 申请公布日期 1985.09.10
申请号 JP19840032832 申请日期 1984.02.23
申请人 TOSHIBA KK 发明人 FURUYA KUNIO
分类号 H01L23/50;H01L21/48 主分类号 H01L23/50
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