| 摘要 |
<p>PURPOSE:To improve operation efficiency, and to manufacture a large number of the titled substrates by forming a base material block by laminating a plurality of the substrates, in which a conductor band plate is inserted and bonded in a groove in a junction surface, and cutting the block to a desired piece shape. CONSTITUTION:Grooves 13 are formed to junction surfaces 12 in substrates 11 consisting of alumina porcelain, ferrite, ceramics, etc. in parallel, conductor band plates 14 are inserted and bonded in the grooves, and projecting sections 14a are inserted and bonded in grooves 13 in other substrates 11, thus forming a substrate block 15. The substrate block 15 is cut in predetermined thickness in the direction orthogonal to the axial direction of the conductor band plates 14, cut among the junction surfaces 12, and cut to piece shapes having desired leading-out electrodes 17, thus obtaining chip-shaped electronic-part substrates 18.</p> |
