发明名称 |
SEALING TREATMENT OF SINTERED MEMBER |
摘要 |
PURPOSE:To enable formation of a unform plating layer on the surface of a sintered member subjected to a sealing treatment of holes by impregnating under vacuum the liquid of a metallic paste material diluted with a solvent into the holes of the sintered member and subjecting the sintered member to heating treatment in a non-oxidative atmosphere to solidify the liquid. CONSTITUTION:The liquid of a copper paste material diluted with an alcohol solvent or the like is impregnated under vacuum into the holes 2 of a sintered member 1 consisting of a metallic material and thereafter the member is inserted into a nonoxidative atmosphere furnace and is subjected to a heating treatment to solidify the liquid thus forming layer 5 of the copper material in the holes 2 and on the surface. The holes 2 on the surface of the sintered member 1 are thus sealed. The top layer thereof is subjected to a plating treatment by which a uniform plating layer 4 is formed.
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申请公布号 |
JPS60174803(A) |
申请公布日期 |
1985.09.09 |
申请号 |
JP19840031019 |
申请日期 |
1984.02.21 |
申请人 |
FUJITSU KK;FUJITSUU SHINTAA KK |
发明人 |
NAGASHIMA KANJI;FUKUMA EIJI;NAKAYAMA JIROU |
分类号 |
B22F3/26;B22F3/24;C23C18/18;C25D7/00 |
主分类号 |
B22F3/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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