| 摘要 |
PURPOSE:To constitute the titled method so that productivity is improved and generation of pin holes does not occur, by making use of adhesive force of uncured FRP forming a back up layer for adhesion between a base material and the back up layer and between the back up layer and a corrugated layer. CONSTITUTION:A mold release film 2 such as polyvinyl alcohol is mounted on a base board 7 and a corrugated layer 3 is formed by applying polyester resin to the film. Then a back up layer 4 is formed by mounting FRP with which polyester resin has been impregnated on a base material 5, and a laminated layer part 6 is formed by the semicured corrugated layer 3 during unkneaded state of the back up layer 4. After removal of gas between the corrugated layer 3 and the back layer 4 by pressing the surface of the mold release film 2 by a roll 8, the mold release film 2 is peeled off by making the laminated layer part 6 cure at the room temperature. As high pressure is not necessary for adhesion a large processing equipment is unnecessary and as an adhesive agent is not used applying work of the agent becomes unnecessary and productivity can be improved. |
