| 摘要 |
PURPOSE:To make the surface flat easily with a high precision by leaving only a negative photoresist layer in recessed parts as they are after providing the negative photoresist layer on a transparent substrate for the purpose of eliminating the ruggedness due to opaque or semitransparent thin film patterns formed on the transparent substrate. CONSTITUTION:The negative photoresist is applied to the surface of a transparent substrate 1, on which thin film patterns 2 are formed, by a spin coating method or the like or provide a photoresist layer 3 having the same layer thickness as thin film patterns. Next, when rays (parallel rays) such as ultraviolet rays or the like are irradiated from the rear face of the substrate, opaque or semitransparent thin film patterns 2 are used as photomasks to make only photoresist parts, which do not overlap these patterns, development-proof, and development processing is performed to remove only parts, which are not made development-proof, on thin film patterns. That is, resist patterns 3' opposite (or complementary) to thin film patterns 2 are formed, thus making the surface of the substrate flat.
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