| 摘要 |
PURPOSE:To make the surface flat easily with a high precision by using already formed thin film patterns as photomasks to form resist patterns in the lift-off method where resist patterns are peeled and removed together with insulating films. CONSTITUTION:A positive photoresist is applied to the surface of a transparent substrate 1, on which thin film patterns 2 are formed, by a spin coating method or the like to provide a photoresist layer 3, and rays such as ultraviolet rays or the like are irradiated from the rear face of the substrate to expose it, and development processing is performed to remove the photoresist only in exposed parts, and thus, the same resist patterns 3' as thin film patterns are obtained. Next, an insulating layer 4 is formed on the transparent substrate 1 with the same thickness as thin film patterns 2 by sputtering or the like. The obtained substrate is processed with a resist removing liquid to peel the photoresist, and thus, the flat surface of the substrate where recessed parts of thin film patterns 2 are filled with insulating layer patterns 4' is obtained.
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