发明名称 MEASURING METHOD OF HEAT CONDUCTIVITY OF THIN FILM
摘要 PURPOSE:To measure the heat conductivity of a laminated insulating thin film by embedding conductors made of metal or a semiconductor which has a high fusion point and large variation in specific resistance with temperature in the insulating thin film in two upper and lower stages, and detecting variation in resistance with temperature. CONSTITUTION:An SiO2 film 21 is formed on a substrate 1 as the insulating film to be measured to thickness d2, and an Mo film 4 is formed thereupon and patterned. Further, an SiO2 film 22 is formed thereupon to thickness d1, and an Mo film 5 is formed on it and patterned. Temperature sensing parts 4a and 4b of the Mo films 4 and 5 are formed orthogonally. An SiO2 film 23 and then a polycrystalline Si layer 3 are formed on the Mo film 5. The temperature sensing parts 4a and 5a are irradiated with pulse laser light from above and resistance variations of the Mo films 4 and 5 due to temperature rises of the temperature sensing parts 4a and 5a are detected to calculate the heat conductivity of the laminated SiO2 insulating film 2.
申请公布号 JPS60173449(A) 申请公布日期 1985.09.06
申请号 JP19840031008 申请日期 1984.02.20
申请人 SHARP KK 发明人 KAKIMOTO SEIZOU
分类号 G01N25/18;(IPC1-7):G01N25/18 主分类号 G01N25/18
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